CHAMP-XD3 3U VPX Intel Xeon D-1700 Processor Card

The CHAMP-XD3 3U OpenVPX Intel Ice Lake Xeon D-1700 DSP Processor Card features high-speed DDR4 memory, 10 Gb Ethernet, 40 Gb Ethernet Data Plane, Xilinx VPXvpxZynq® UltraScale+™ MPSoC FPGA for enhanced security, and is available in rugged conduction and air-cooled versions. The Processor card is ideal for Digital Signal Processing, HPEC, Cognitive DSP, AI & Machine Learning in highly compute-intensive industrial, aerospace, and defense applications. The CHAMP-XD3 3U VPX Intel Xeon D-1700 Processor Card assures high-Performance Embedded Computing Processing, Proven Foundation for Machine Learning and Strengthened Security Capabilities.

CHAMP-XD3 3U VPX Intel Xeon D-1700 Processor Card supports leading Open Standards including the SOSA™ Technical Standard. This high-performance module, designed for the rigors of digital signal processing (DSP) and emerging machine learning and artificial intelligence applications, delivers incredible processing capability through its 10-core Intel “Ice Lake” Xeon D-1700 processor. The board includes a core function FPGA for critical board functions and general purpose I/O, and includes a dedicated Intelligent Platform Management Interface (IPMI) for system monitoring and health.

CHAMP-XD3 brings new levels of performance to your ISR and EW systems. The CHAMP-XD3 combines the high core count and floating-point performance of the latest Intel “Ice Lake” Xeon D-1700 processors with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form-factor. Providing an extended temperature Intel “Ice Lake” Xeon D-1700 LCC processor with 10 cores, the CHAMP-XD3 brings Intel’s new AVX512 floating-point capability to the rugged embedded marketplace. This is coupled with 48 GB of high capacity DDR4-2400 with a bandwidth of >19 GBps per channel with three channels per processor. The extra memory bank and speed provide over 50% more memory bandwidth than prior generation modules ensuring memory accesses are not a bottleneck.

The CHAMP-XD3 offers variants to support your specific requirements, including models developed in alignment with the SOSA Technical Standard. The CHAMP-XD3 supports a 40GbE Data Plane, dual 10 GbE interfaces, and up to 16 lanes of Gen3 PCI Express® (PCIe) on the Expansion Plane. (Contact factory for Gen4 speeds.)

The CHAMP-XD3 is part of Curtiss-Wright’s TrustedCOTS portfolio, offering built-in a AMD MPSoC FPGA with embedded dual-core Arm® A53 processor and dual-core R5 processor. In addition, the Ice Lake D processor brings new security capabilities to the Xeon D-1700 processor line, including Total Memory Encryption (TME), Software Guard Extensions (SGX), and Bootguard.

The CHAMP-XD3 3U VPX Intel Xeon D-1700 Processor Card is designed to meet the needs of cutting-edge applications like Multi-mode Radars, Synthetic Aperture Radars(SAR), Signal Intelligence (SIGINT), Electro-Optical/Infrared platforms (EO/IR), Electronic Warfare (EW), Mission computing and Industrial servers, among others.